@Article{cmes.2015.107.081,
AUTHOR = {X.  Wang, W.T.  Ang, H.  Fan},
TITLE = {A Micromechanical Model for Estimating the Effective Stiffness of a Pair of Micro-cracked Interfaces in an Orthotropic Trimaterial under Inplane Deformations},
JOURNAL = {Computer Modeling in Engineering \& Sciences},
VOLUME = {107},
YEAR = {2015},
NUMBER = {2},
PAGES = {81--101},
URL = {http://www.techscience.com/CMES/v107n2/27251},
ISSN = {1526-1506},
ABSTRACT = {A micromechanical model is proposed here for estimating the effective stiffness of a pair of parallel microscopically damaged interfaces in a trimaterial under inplane elastostatic deformations. The trimaterial is made of an orthotropic thin layer sandwiched between two orthotropic half-spaces. The microscopically damaged interfaces are modeled using periodically distributed interfacial micro-cracks. The micromechanical model is formulated and numerically solved in terms of hypersingular boundary integro-differential equations. The effects of the width of the thin layer, the micro-crack densities of the two interfaces and the material constants of the thin layer and the two half-spaces on the effective stiffness coefficients are investigated.},
DOI = {10.3970/cmes.2015.107.081}
}