TY  - EJOU
AU  - Wang, X.  
AU  - Ang, W.T.  
AU  - Fan, H.  

TI  - A Micromechanical Model for Estimating the Effective Stiffness of a Pair of Micro-cracked Interfaces in an Orthotropic Trimaterial under Inplane Deformations
T2  - Computer Modeling in Engineering \& Sciences

PY  - 2015
VL  - 107
IS  - 2
SN  - 1526-1506

AB  - A micromechanical model is proposed here for estimating the effective stiffness of a pair of parallel microscopically damaged interfaces in a trimaterial under inplane elastostatic deformations. The trimaterial is made of an orthotropic thin layer sandwiched between two orthotropic half-spaces. The microscopically damaged interfaces are modeled using periodically distributed interfacial micro-cracks. The micromechanical model is formulated and numerically solved in terms of hypersingular boundary integro-differential equations. The effects of the width of the thin layer, the micro-crack densities of the two interfaces and the material constants of the thin layer and the two half-spaces on the effective stiffness coefficients are investigated.
KW  - Micromechanics
KW  -  Microscopically damaged interface
KW  -  Effective stiffness coefficients
KW  -  Trimaterial
KW  -  Thin film
KW  -  Hypersingular integral and integrodifferential equations

DO  - 10.3970/cmes.2015.107.081