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ARTICLE

First-principles Calculation of Interfacial Adhesion Strength and Electromigration for the Micro-bump Interconnect of 3D Chip Stacking Packaging

W.H. Chen1, H.C. Cheng2,3, C.F. Yu1,3

Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan, ROC.
Department of Aerospace and Systems Engineering Feng Chia University, Taichung, Taiwan, ROC.
Corresponding author.

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