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A Multi-Layered Model for Heat Conduction Analysis of Thermoelectric Material Strip

Shenghu Ding1,*, Qingnan Liu1

School of Mathematics and Statistics, Ningxia University, Yinchuan, 750021, China.
* Corresponding author: Shenghu Ding. Email: dshnx2006@163.com.

TSP_CMES_335.pdf

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