%0 Journal Article
%A Liu, Kuan-Ting
%A Lu, Chun-Lin
%A Tai, Nyan-Hwa
%A Yeh, Meng-Kao

%D 2020
%J Computer Modeling in Engineering \& Sciences

%@ 1526-1506
%V 122
%N 2
%P 661--674

%T Stress Analysis of Printed Circuit Board with Different Thickness and Composite Materials Under Shock Loading
%M doi:10.32604/cmes.2020.07792
%U http://www.techscience.com/CMES/v122n2/38318