TY  - EJOU
AU  - Liu, Kuan-Ting 
AU  - Lu, Chun-Lin 
AU  - Tai, Nyan-Hwa 
AU  - Yeh, Meng-Kao 

TI  - Stress Analysis of Printed Circuit Board with Different Thickness and Composite Materials Under Shock Loading
T2  - Computer Modeling in Engineering \& Sciences

PY  - 2020
VL  - 122
IS  - 2
SN  - 1526-1506

AB  - In this study, the deformation and stress distribution of printed circuit board
(PCB) with different thickness and composite materials under a shock loading were
analyzed by the finite element analysis. The standard 8-layer PCB subjected to a shock 
loading 1500 g was evaluated first. Moreover, the finite element models of the PCB with 
different thickness by stacking various number of layers were discussed. In addition to 
changing thickness, the core material of PCB was replaced from woven E-glass/epoxy to 
woven carbon fiber/epoxy for structural enhancement. The non-linear material property 
of copper foil was considered in the analysis. The results indicated that a thicker PCB has 
lower stress in the copper foil in PCBs under the shock loading. The stress difference 
between the thicker PCB (2.6 mm) and thinner PCB (0.6 mm) is around 5%. Using 
woven carbon fiber/epoxy as core material could lower the stress of copper foil around 
6.6% under the shock loading 1500 g for the PCB with 0.6 mm thickness. On the other 
hand, the stress level is under the failure strength of PCBs with carbon fiber/epoxy core 
layers and thickness 2.6 mm when the peak acceleration changes from 1500 g to 5000 g. 
This study could provide a reference for the design and proper applications of the PCB 
with different thickness and composite materials.
KW  - Stress analysis
KW  -  printed circuit board
KW  -  composite material
KW  -  finite element analysis
KW  -  shock loading

DO  - 10.32604/cmes.2020.07792