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Numerical Implementation of a Unified Viscoplastic Model for Considering Solder Joint Response under Board-Level Temperature Cycling

Hung-Chun Yang, Tz-Cheng Chiu*

Department of Mechanical Engineering, National Cheng Kung University, Tainan, 701, Taiwan

* Corresponding Author: Tz-Cheng Chiu. Email: email

TSP_CMES_16159.pdf

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