Open Access

ARTICLE

Numerical and Experimental Investigations of the Thermal Fatigue Lifetime of CBGA Packages

Borui Yang¹, Jun Luo², Bo Wan^1,*, Yutai Su^1,3, Guicui Fu¹, Xu Long^3,*

1 School of Reliability and Systems Engineering, Beihang University, Beijing, 100191, China
2 Sichuan Institute of Solid-State Circuits, China Electronics Technology Group Corporation, Chongqing, 400060, China
3 School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi’an, 710072, China

* Corresponding Authors: Bo Wan. Email: ; Xu Long. Email: