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Numerical and Experimental Investigations of the Thermal Fatigue Lifetime of CBGA Packages

Borui Yang1, Jun Luo2, Bo Wan1,*, Yutai Su1,3, Guicui Fu1, Xu Long3,*

1 School of Reliability and Systems Engineering, Beihang University, Beijing, 100191, China
2 Sichuan Institute of Solid-State Circuits, China Electronics Technology Group Corporation, Chongqing, 400060, China
3 School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi’an, 710072, China

* Corresponding Authors: Bo Wan. Email: email; Xu Long. Email: email

TSP_CMES_18037.pdf

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