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A Novel Meshfree Analysis of Transient Heat Conduction Problems Using RRKPM

Hongfen Gao1, Gaofeng Wei2,3,*

1 College of Intelligent Engineering, Shandong Management University, Jinan, 250357, China
2 School of Mechanical and Automotive Engineering, Qilu University of Technology (Shandong Academy of Sciences), Jinan, 250353, China
3 Shandong Institute of Mechanical Design and Research, Jinan, 250353, China

* Corresponding Author: Gaofeng Wei. Email: email

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