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Computational Modeling of Intergranular Crack Propagation in an Intermetallic Compound Layer

Tong An1,2,*, Rui Zhou1,2, Fei Qin1,2,*, Pei Chen1,2, Yanwei Dai1,2, Yanpeng Gong1,2

1 Institute of Electronics Packaging Technology and Reliability, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
2 Beijing Key Laboratory of Advanced Manufacturing Technology, Beijing University of Technology, Beijing, 100124, China

* Corresponding Authors: Tong An. Email: email; Fei Qin. Email: email

TSP_CMES_22475.pdf

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