@Article{cmes.2024.050488,
AUTHOR = {Liping Zu, Yaxun Liu, Haoran Zhang, Lisheng Liu, Xin Lai, Hai Mei},
TITLE = {An Elastoplastic Fracture Model Based on Bond-Based Peridynamics},
JOURNAL = {Computer Modeling in Engineering \& Sciences},
VOLUME = {140},
YEAR = {2024},
NUMBER = {3},
PAGES = {2349--2371},
URL = {http://www.techscience.com/CMES/v140n3/57244},
ISSN = {1526-1506},
ABSTRACT = {Fracture in ductile materials often occurs in conjunction with plastic deformation. However, in the bond-based peridynamic (BB-PD) theory, the classic mechanical stress is not defined inherently. This makes it difficult to describe plasticity directly using the classical plastic theory. To address the above issue, a unified bond-based peridynamics model was proposed as an effective tool to solve elastoplastic fracture problems. Compared to the existing models, the proposed model directly describes the elastoplastic theory at the bond level without the need for additional calculation means. The results obtained in the context of this model are shown to be consistent with FEM results in regard to force-displacement curves, displacement fields, stress fields, and plastic deformation regions. The model exhibits good capability of capturing crack propagation in ductile material failure problems.},
DOI = {10.32604/cmes.2024.050488}
}