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Modelling and Validation of Contribions to Stress in the Shallow Trench Isolation Process Sequence

K. Garikipati1, V.S. Rao2, M.Y. Hao3, E. Ibok4, I. de Wolf5, R. W. Dutton6

Stanford University, Stanford, California
Schlumberger Cambridge Research Centre, Cambridge, UK
Advanced Micro Devices Inc., Santa Clara, California
Advanced Micro Devices Inc., Santa Clara, California
Interuniversity Micro-electronics Center, Leuven, Belgium
Stanford University, Stanford, California

TSP_CMES_65.pdf

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