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Numerical Simulation of Fatigue Crack Growth in Microelectronics Solder Joints

K. Kaminishi1, M. Iino2, H. Bessho2, M. Taneda3

Department of Mechanical Engineering, Yamaguchi University, 2557 Toki-wadai, Ube City, 755-8611, Japan
Department of Mechanical Engineering, Yamaguchi University, 2557 Toki-wadai, Ube City, 755-8611, Japan
Department of Mechanical Engineering, Fukuyama University, GakuenCho 1, Fukuyama City, 729-0292, Japan

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