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Fast analysis system for embossing process simulation of commemorative coin--CoinForm

J. P. Xu1, Y. Q. Liu1,2, S. Q. Li3, S. C. Wu4

State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan, 430074, PR China
Corresponding author at: State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science & Technology, 1037 Luoyu Road, Wuhan Hubei 430074, PR China. Tel.: +86 27 87558193; fax: +86 27 87554405; Email: fastamp@vip.sina.com (Liu Yuqi)
Shenyang Mint, Shenyang, 110042, PR China
School of Materials Science and Engineering, Hefei University of Technology, Hefei, 230009, PR China

TSP_CMES_201.pdf

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