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Study of the Underfill Effect on the Thermal Fatigue Life of WLCSP-Experiments and Finite Element Simulations

Shaw-Jyh Shin1, Chen-Hung Huang2, Y.C. Shiah3

Dept. of Communications Eng., Feng Chia University, R.O.C.
Dept. of Aerospace and Systems Eng., Feng Chia University, R.O.C.
Corresponding Author. Dept. of Aerospace and Systems Eng., Feng Chia University, R.O.C., Email: ycshiah@fcu.edu.tw

TSP_CMES_83.pdf

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