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An Effective Thermal-mechanical Modeling Methodology for Large-scale Area Array Typed Packages

H. C. Cheng1, C. Y. Yu2, W. H. Chen3

Associate Professor, Department of Aerospace and Systems Engineering, Feng Chia University, Taichung, Taiwan 407, R.O.C., hccheng@fcu.edu.tw
Graduate Student, Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan 300, R.O.C.
Professor, Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan 300, R.O.C., whchen@pme.nthu.edu.tw

TSP_CMES_1.pdf

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