%0 Journal Article
%A Chernin, L.
%A Volokh, K.Y.

%D 2004
%J Computers, Materials \& Continua

%@ 1546-2226
%V 1
%N 3
%P 259--274

%T Simulation of Thin Film Delamination Under Thermal Loading
%M doi:10.3970/cmc.2004.001.259
%U http://www.techscience.com/cmc/v1n3/22355