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ARTICLE

Stability of Solder Bridging for Area Array Type Packaging

Wen-Hwa Chen1,2, Shu-Ru Lin2, Kuo-Ning Chiang2,3

Corresponding author, whchen@pme.nthu.edu.tw
Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan 30013, Republic of China
knchiang@pme.nthu.edu.tw

TSP_CMC_151.pdf

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