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ARTICLE

Process-dependent Thermal-Mechanical Behaviors of an Advanced Thin-Flip-Chip-on-Flex Interconnect Technology with Anisotropic Conductive Film Joints

Hsien-Chie Cheng1,2, Chien-Hao Ma1, Ching-Feng Yu3, Su-Tsai Lu4, Wen-Hwa Chen2,3

Department of Aerospace and Systems Engineering, Feng Chia University, Taichung, Taiwan, ROC.
Corresponding author.
Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan, ROC.
Electronics and Optoelectronics Research Laboratories, ITRI, Hsinchu, Taiwan, ROC.

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