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Rupture and Instability of Soft Films due to Moisture Vaporization in Microelectronic Devices

Linsen Zhu1, Jiang Zhou2, Xuejun Fan2

Research Center of Mechanics and Mechatronic Equipment, Shandong University #180 W. Wenhua Road, Weihai, Shandong 264209, P.R. China. E-mail: zlinsen@sina.com
Department of Mechanical Engineering, Lamar University, Beaumont, Texas 77710, USA. E-mail: jenny.zhou@lamar.edt; xuejun.fan@lamar.edu

TSP_CMC_113.pdf

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