%0 Journal Article
%A Lin, Heng-Cheng
%A Kung, Chieh
%A Chen, Rong-Sheng
%A Liang, Gin-Tiao

%D 2006
%J Computers, Materials \& Continua

%@ 1546-2226
%V 3
%N 2
%P 55--64

%T An Optimization Analysis of UBM Thicknesses and Solder Geometry on A Wafer Level Chip Scale Package Using Robust Methods
%M doi:10.3970/cmc.2006.003.055
%U http://www.techscience.com/cmc/v3n2/22375