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ARTICLE

An Optimization Analysis of UBM Thicknesses and Solder Geometry on A Wafer Level Chip Scale Package Using Robust Methods

Heng-Cheng Lin1, Chieh Kung2, Rong-Sheng Chen1, Gin-Tiao Liang1

Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan.
Department of Computer Application Engineering, Far East College, Tainan, Taiwan.

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