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Optimization of Johnson-Cook Constitutive Model for Lead-free Solder Using Genetic Algorithm and Finite Element Simulations

D.S.Liu1, C.L.Hsu1,2

Advanced Institute of Manufacturing for High-tech Innovations and Department of Mechanical Engineering, National Chung Cheng University, Chia-yi County, Taiwan, R.O.C.
Corresponding author. Tel.: +886-5-2720411 (Ext: 23347); fax: +886-5-2720589; Email: changlin0331@gmail.com

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