
%0 Journal Article
%A Ou, Zhicheng
%A Yao, Xiaohu
%A Zhang, Xiaoqing
%A Fan, Xuejun

%D 2014
%J Computers, Materials \& Continua

%@ 1546-2226
%V 44
%N 3
%P 205--222

%T Wrinkling Analysis in a Film Bonded to a Compressible Compliant Substrate in Large Deformation
%M doi:10.3970/cmc.2014.044.205
%U http://www.techscience.com/cmc/v44n3/22780


