TY - EJOU
AU - El-Aziz, Mohamed Abd
AU - Aly, A. M.
TI - Entropy Generation for Flow and Heat Transfer of Sisko-Fluid Over an Exponentially Stretching Surface
T2 - Computers, Materials \& Continua
PY - 2020
VL - 62
IS - 1
SN - 1546-2226
AB - In the present study, the effects of the magnetic field on the entropy generation
during fluid flow and heat transfer of a Sisko-fluid over an exponentially stretching
surface are considered. The similarity transformations are used to transfer the governing
partial differential equations into a set of nonlinear-coupled ordinary differential
equations. Runge-Kutta-Fehlberg method is used to solve the governing problem. The
effects of magnetic field parameter *M*, local slip parameter λ, generalized Biot number γ,
Sisko fluid material parameter *A*, Eckert number Ec, Prandtl number Pr and Brinkman
number *Br* at two values of power law index on the velocity, temperature, local entropy
generation number *N*_{G} and Bejan number Be are inspected. Moreover, the tabular forms
for local skin friction coefficient and local Nusselt number under the effects of the
physical parameters are exhibited. The current results are helpful in checking the entropy
generation for Sisko-fluid. It is found that, an extra magnetic field parameter makes
higher Lorentz force that suppresses the velocity. For shear thinning fluids (n < 1), the
temperature dominates and the velocity rises. Local entropy generation number is more
for larger generalized Biot number, magnetic field parameter and Brinkman number. The
local skin friction coefficient increases as magnetic field parameter and material
parameter are increase and it decreases as local slip parameter increases. The local
Nusselt number decreases as magnetic field parameter, local slip parameter and Eckert
number are increase, while it increases as material parameter, generalized Biot number
and Prandtl number are increase.
KW - Boundary layer
KW - entropy generation
KW - exponentially stretching surface
KW - magnetic field
KW - sisko-fluid
DO - 10.32604/cmc.2020.08488