%0 Journal Article %A Wang, Miaocao %A Huang, Yuhua %A Li, Jinming %A Xu, Ling %A Zhu, Fulong %D 2021 %J Computers, Materials \& Continua %@ 1546-2226 %V 68 %N 1 %P 743--759 %T Local Stress Field in Wafer Thinning Simulations with Phase Space Averaging %M doi:10.32604/cmc.2021.016372 %U http://www.techscience.com/cmc/v68n1/41857