%0 Journal Article
%A Lin, Heng-Cheng
%A Kung, Chieh
%A Chen, Rong-Sheng

%D 2007
%J Computers, Materials \& Continua

%@ 1546-2226
%V 6
%N 1
%P 43--50

%T Evaluations of the BGA Solder Ball Shape by Using Energy Method
%M doi:10.3970/cmc.2007.006.043
%U http://www.techscience.com/cmc/v6n1/23437