%0 Journal Article
%A Jin, Dingyi
%A Wei, Guo

%D 2024
%J Computers, Materials \& Continua

%@ 1546-2226
%V 79
%N 3
%P 3455--3468

%T MD Simulation of Diffusion Behaviors in Collision Welding Processes of Al-Cu, Al-Al, Cu-Cu
%M doi:10.32604/cmc.2024.048644
%U http://www.techscience.com/cmc/v79n3/57093