@Article{cmc.2025.059727,
AUTHOR = {Jialiang Dong, Xuemao Dong, Zhongxue Feng, Caiju Li, Jianhong Yi, Jun Tan},
TITLE = {Second Nearest-Neighbor Modified Embedded Atom Method Interatomic Potential for Cu-Ni-Sn Ternary System},
JOURNAL = {Computers, Materials \& Continua},
VOLUME = {83},
YEAR = {2025},
NUMBER = {1},
PAGES = {65--77},
URL = {http://www.techscience.com/cmc/v83n1/60075},
ISSN = {1546-2226},
ABSTRACT = {To explore atomic-level phenomena in the Cu-Ni-Sn alloy, a second nearest-neighbor modified embedded-atom method (2NN MEAM) potential has been developed for the Cu-Ni-Sn system, building upon the work of other researchers. This potential demonstrates remarkable accuracy in predicting the lattice constant, with a relative error of less than 0.5% when compared to density functional theory (DFT) results, and it achieves a 10% relative error in the enthalpy of formation compared to experimental data, marking substantial advancements over prior models. The bulk modulus is predicted with a relative error of 8% compared to DFT. Notably, the potential effectively simulates the processes of melting and solidification of Cu-15Ni-8Sn, with a simulated melting point that closely aligns with the experimental value, within a 7.5% margin. This serves as a foundation for establishing a 2NN MEAM potential for a flawless Cu-Ni-Sn system and its microalloying systems.},
DOI = {10.32604/cmc.2025.059727}
}