@Article{fdmp.2012.008.295,
AUTHOR = {Y.  Amirouche, R.  Bessaïh},
TITLE = {Three-Dimensional Numerical Simulation of Air Cooling of  Electronic Components in a Vertical Channel},
JOURNAL = {Fluid Dynamics \& Materials Processing},
VOLUME = {8},
YEAR = {2012},
NUMBER = {3},
PAGES = {295--310},
URL = {http://www.techscience.com/fdmp/v8n3/24303},
ISSN = {1555-2578},
ABSTRACT = {This paper summarizes a series of computational results originating from the simulation of three-dimensional turbulent natural convection occurring in a vertical channel containing 5 cubic aluminum heated sources (mimicking a set of electronics components equally spaced in the vertical direction). A three-dimensional, conjugate heat transfer model with appropriate boundary conditions is used. In particular, the governing equations are solved by a finite volume method throughout the entire physical domain. Calculations are made for distinct values of: the Rayleigh number, the ratio (air/solid) of thermal conductivities and other geometrical parameters (in order to examine the influence of such variables on the resulting heat transfer inside the channel).},
DOI = {10.3970/fdmp.2012.008.295}
}