TY  - EJOU
AU  - Amirouche, Y.  
AU  - Bessaïh, R.  

TI  - Three-Dimensional Numerical Simulation of Air Cooling of  Electronic Components in a Vertical Channel
T2  - Fluid Dynamics \& Materials Processing

PY  - 2012
VL  - 8
IS  - 3
SN  - 1555-2578

AB  - This paper summarizes a series of computational results originating from the simulation of three-dimensional turbulent natural convection occurring in a vertical channel containing 5 cubic aluminum heated sources (mimicking a set of electronics components equally spaced in the vertical direction). A three-dimensional, conjugate heat transfer model with appropriate boundary conditions is used. In particular, the governing equations are solved by a finite volume method throughout the entire physical domain. Calculations are made for distinct values of: the Rayleigh number, the ratio (air/solid) of thermal conductivities and other geometrical parameters (in order to examine the influence of such variables on the resulting heat transfer inside the channel).
KW  - Turbulent
KW  -  Natural convection
KW  -  Cooling
KW  -  Electronic components
KW  -  Channel

DO  - 10.3970/fdmp.2012.008.295