TY - EJOU
AU - Amirouche, Y.
AU - Bessaïh, R.
TI - Three-Dimensional Numerical Simulation of Air Cooling of Electronic Components in a Vertical Channel
T2 - Fluid Dynamics \& Materials Processing
PY - 2012
VL - 8
IS - 3
SN - 1555-2578
AB - This paper summarizes a series of computational results originating from the simulation of three-dimensional turbulent natural convection occurring in a vertical channel containing 5 cubic aluminum heated sources (mimicking a set of electronics components equally spaced in the vertical direction). A three-dimensional, conjugate heat transfer model with appropriate boundary conditions is used. In particular, the governing equations are solved by a finite volume method throughout the entire physical domain. Calculations are made for distinct values of: the Rayleigh number, the ratio (air/solid) of thermal conductivities and other geometrical parameters (in order to examine the influence of such variables on the resulting heat transfer inside the channel).
KW - Turbulent
KW - Natural convection
KW - Cooling
KW - Electronic components
KW - Channel
DO - 10.3970/fdmp.2012.008.295