TY  - EJOU
AU  - Momenabadi, Ali Anari 
AU  - Ahmadpour, Ali 
AU  - Hajmohammadi, Mohammad Reza 
AU  - Lorenzini, Giulio 

TI  - Thermal Design Enhancement of a Single Phase Immersion Cooling System for Data Servers
T2  - Frontiers in Heat and Mass Transfer

PY  - 
VL  - 
IS  - 
SN  - 2151-8629

AB  - In this study, the thermal and hydraulic performance of a single-phase immersion cooling system for data servers was numerically investigated using three-dimensional CFD simulations in ANSYS Fluent. The flow was assumed to be laminar, incompressible, and steady, with Reynolds numbers ranging from 644 to 1932. The numerical model was validated against both experimental measurements and published numerical results, demonstrating good agreement. The effects of inlet–outlet arrangement, flow guide plate geometry, and Al<sub>2</sub>O<sub>3</sub> nanofluid on the cooling performance were systematically investigated, and the optimized flow arrangement and flow guide plate were further evaluated in a dual-server configuration. Compared with the baseline T-type flow arrangement, the optimized inlet–outlet configuration produced only a modest improvement in thermal performance while slightly reducing the pressure drop. The optimized convex flow guide plate reduced the server case temperature by 10% with only a minor increase in pressure drop, whereas the addition of 2 wt.% Al<sub>2</sub>O<sub>3</sub> nanoparticles to FC-40 further reduced the case temperature by 11.9%, yielding a thermal performance factor (TPF, indicating the balance between heat transfer enhancement and pressure drop penalty) of 1.11. For the dual-server configuration, the optimized flow arrangement and flow guide plates reduced the case temperatures of the first and second servers by 10% and 0.6%, respectively. These results demonstrate that combining geometric optimization with nanofluid enhancement provides an effective strategy for improving the thermal performance of single-phase immersion cooling systems for data servers.
KW  - CFD; heat sink; single-phase immersion cooling; data center cooling; nanofluid

DO  - 10.32604/fhmt.2026.085619