@Article{hmt.13.1,
AUTHOR = {B. Orr
, R. Singh, T. L. Phan
, M. Mochizuki},
TITLE = {TRANSIENT MODELLING OF AN EV INVERTER HEAT SINK WITH  PCM},
JOURNAL = {Frontiers in Heat and Mass Transfer},
VOLUME = {13},
YEAR = {2019},
NUMBER = {1},
PAGES = {1--6},
URL = {http://www.techscience.com/fhmt/v13n1/53136},
ISSN = {2151-8629},
ABSTRACT = {One of the problems with cooling an IGBT inverter chip is that its heat generation is not constant. These chips tend to produce heat in pulses which 
results in high peak chip temperatures. Transient modelling is required to determine the suitability of a heat sink and to ensure the max peak 
temperature is not exceeded. This paper demonstrates a method of transient thermal analysis using a thermal resistance / capacitor network. A sample 
heat sink was modelled and then experimentally tested to validate the model. A novel method of modelling phase change materials (PCM) using the 
thermal resistance / capacitor network was also demonstrated. The use of PCM was modelled because it has the potential to reduce peak chip 
temperatures. This model was used to optimise the PCM location, melting temperature and mass.},
DOI = {10.5098/hmt.13.1}
}