@Article{hmt.v1.2.3006,
AUTHOR = {Peter Kasten, Severin Zimmermann, Manish K. Tiwari, Bruno Michel, Dimos Poulikakos},
TITLE = {HOT WATER COOLED HEAT SINKS FOR EFFICIENT DATA CENTER  COOLING: TOWARDS ELECTRONIC COOLING WITH HIGH  EXERGETIC UTILITY},
JOURNAL = {Frontiers in Heat and Mass Transfer},
VOLUME = {1},
YEAR = {2010},
NUMBER = {2},
PAGES = {1--10},
URL = {http://www.techscience.com/fhmt/v1n2/55802},
ISSN = {2151-8629},
ABSTRACT = {Electronic data center cooling using hot water is proposed for high system exergetic utility. The proof-of-principle is provided by numerically 
modeling a manifold micro-channel heat sink for cooling microprocessors of a data center. An easily achievable 0.5l/min per chip water flow, with 
60°C inlet water temperature, is found sufficient to address the typical data center thermal loads. A maximum temperature difference of ~8°C was 
found between the solid and liquid, confirming small exergetic destruction due to heat transport across a temperature differential. The high water 
outlet temperature from the heat sink opens the possibility of waste heat recovery applications.},
DOI = {10.5098/hmt.v1.2.3006}
}