@Article{fhmt.2025.063023,
AUTHOR = {Umi Nadrah Hussein, Najiyah Safwa Khashi’ie, Norihan Md Arifin, Ioan Pop},
TITLE = {Heat Transfer and Flow Dynamics of Ternary Hybrid Nanofluid over a Permeable Disk under Magnetic Field and Joule Heating Effects},
JOURNAL = {Frontiers in Heat and Mass Transfer},
VOLUME = {23},
YEAR = {2025},
NUMBER = {2},
PAGES = {383--395},
URL = {http://www.techscience.com/fhmt/v23n2/60707},
ISSN = {2151-8629},
ABSTRACT = {This study investigates the heat transfer and flow dynamics of a ternary hybrid nanofluid comprising alumina, copper, and silica/titania nanoparticles dispersed in water. The analysis considers the effects of suction, magnetic field, and Joule heating over a permeable shrinking disk. A mathematical model is developed and converted to a system of differential equations using similarity transformation which then, solved numerically using the bvp4c solver in Matlab software. The study introduces a novel comparative analysis of alumina-copper-silica and alumina-copper-titania nanofluids, revealing distinct thermal conductivity behaviors and identifying critical suction values necessary for flow stabilization. Dual solutions are found within a specific range of parameters such that the minimum required suction values for flow stability, with  for alumina-copper-silica/water and  for alumina-copper-titania/water. The results indicate that increasing suction by 1% enhances the skin friction coefficient by up to 4.17% and improves heat transfer efficiency by approximately 1%, highlighting its crucial role in stabilizing the opposing flow induced by the shrinking disk. Additionally, the inclusion of 1% silica nanoparticles reduces both skin friction and heat transfer rate by approximately 0.28% and 0.85%, respectively, while 1% titania concentration increases skin friction by 3.02% but results in a slight heat transfer loss of up to 0.61%. These findings confirm the superior thermal performance of alumina-copper-titania/water, making it a promising candidate for enhanced cooling systems, energy-efficient heat exchangers, and industrial thermal management applications.},
DOI = {10.32604/fhmt.2025.063023}
}