TY  - EJOU
AU  - Ren, Xingjie 
AU  - Zhang, Jianrong 
AU  - Tang, Qingfeng 
AU  - Zhang, Heng 
AU  - Zhang, Yaling 

TI  - A Simulation Study on Heat Transfer of a Three-Layer Contact Structure under Ultrahigh Heat Flux Considering Thermal Contact Resistance
T2  - Frontiers in Heat and Mass Transfer

PY  - 2025
VL  - 23
IS  - 3
SN  - 2151-8629

AB  - This paper investigates interfacial heat transfer characteristics in a multi-layer structure under ultra-high heat flux conditions, focusing on thermal contact resistance (TCR) between adjacent layers. A three-layer computational model with dual rough interfaces was developed to systematically analyze the synergistic effects of interfacial pressure, surface emissivity, and thermal interface materials (TIMs). Surface reconstruction using experimental measurement data generated two representative roughness models to quantify the impact of surface roughness on heat dissipation. Numerical simulations demonstrate that the absence of TIMs leads to insufficient thermal dissipation capacity under ultra-high heat flux conditions. Compared to TIM application, merely increasing the convective heat transfer coefficient shows limited effectiveness in enhancing heat dissipation efficiency.
KW  - Thermal contact resistance; rough surface contact; ultrahigh heat flux

DO  - 10.32604/fhmt.2025.066302