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NUMERICAL INVESTIGATION OF FILM COOLING WITH CHEMICAL HEAT SINK

Keyong Chenga,b,*, Chunzi Zhangc, Wei Chena,b, Shiqiang Lianga,†, Yongxian Guoa,d, Xiulan Huaia

a Institute of Engineering Thermophysics, Chinese Academy of Sciences, Beijing, 100190, China
b Graduate University of Chinese Academy of Sciences, Beijing, 100049, China
c Department of Mechanical Engineering, University of Saskatchewan, 57 Campus Drive, Saskatoon, SK S7N 5A9, Canada
d School of Mechano-electronic Engineering, Xidian University, Xi’an, Shaanxi, 710071, China

Currently in Institute of Engineering Thermophysics, Chinese Academy of Sciences, Beijing, 100190, China
† Corresponding author. Email: email

TSP_FHMT_3003.pdf

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