Open Access

ARTICLE

NUMERICAL INVESTIGATION OF FILM COOLING WITH CHEMICAL HEAT SINK

Keyong Cheng^a,b,*, Chunzi Zhang^c, Wei Chen^a,b, Shiqiang Liang^a,†, Yongxian Guo^a,d, Xiulan Huai^a

a Institute of Engineering Thermophysics, Chinese Academy of Sciences, Beijing, 100190, China
b Graduate University of Chinese Academy of Sciences, Beijing, 100049, China
c Department of Mechanical Engineering, University of Saskatchewan, 57 Campus Drive, Saskatoon, SK S7N 5A9, Canada
d School of Mechano-electronic Engineering, Xidian University, Xi’an, Shaanxi, 710071, China

Currently in Institute of Engineering Thermophysics, Chinese Academy of Sciences, Beijing, 100190, China
† Corresponding author. Email: