TY  - EJOU
AU  - Yu, Ming 
AU  - Zhou, Zeyuan 
AU  - Huang, Zaixing 

TI  - Peridynamic	Analysis	on	Thermal-Elastic	Deformation	of	Isotropic	Plate	 with	Traction	Boundary	Condition
T2  - The International Conference on Computational \& Experimental Engineering and Sciences

PY  - 2023
VL  - 25
IS  - 4
SN  - 1933-2815

AB  - How	to	well	characterize	traction	boundary	condition	is	always	a	difficult	problem	in	peridynamics.	In	order	
to	solve	this	problem,	an integral	term	of	boundary	traction	weighted	by	a	tensor-typical	transfer	function	
is	 added	 to	 the	 original	 peridynamic	 motion equation,	 to	 form	 the	 so-called	 the	 traction-associated	
peridynamic	 motion	 equation.	 The	 traction-associated	 peridynamic	 motion	 equation	 is	 proved	 to	 be	
compatible	with the	conservation	laws	of	linear	and	angular	momentum.	The	conservation	law	of	energy	is	
also	 verified	 to	 have	 the	 same	 form	 as	 the	 original	 peridynamics	 advanced	 by	 Silling.	 Therefore,	 the	
constitutive	 models	 in the	 original	 peridynamics	 can	 be	 directly	 applied	 to	 the	 traction-associated	
peridynamic	 motion	 equation.	By	 the	 inverse	 method,	 the	 transfer	 function	 matching	 with	 the	 classical	
elasticity analytical	solution	of	rod	subjected	to uniaxial	tension	and	thermal	expansion	is	determined	for	
bond-based	constitutive	equation,	and	is	directly extended	to	solve	2-dimensional	thermal-elastic	problems.
The	numerical	solution	of	isotropic	plate	subjected	to uniaxial	tension	and	thermal	expansion	is	given,	and	
compared	 with	 the	 classical	 elasticity	 analytical	 solution.	 The	 results	 show	 that	 the	 traction-associated	
peridynamic	motion	equation	does	not	require	the	volume	correction	and	the	surface	correction,	and	it	not	
only	retains	all	advantages	of	the	original	peridynamics,	but	also	can	conveniently	deal	with	the	complex	
traction	boundary	conditions.
KW  - Traction-associated	peridynamic	motion	equation;	traction	boundary	condition;	bond-based	constitutive	 model; thermal-elastic

DO  - 10.32604/icces.2023.09264
