@Article{icces.2023.09223,
AUTHOR = {Zhaohe Dai},
TITLE = {Peeling	by	Pulling:	Characterizing	the	Mechanical	Behavior	of	Nanoscale	 Thin	Films},
JOURNAL = {The International Conference on Computational \& Experimental Engineering and Sciences},
VOLUME = {26},
YEAR = {2023},
NUMBER = {2},
PAGES = {1--1},
URL = {http://www.techscience.com/icces/v26n2/54039},
ISSN = {1933-2815},
ABSTRACT = {The	flexible	and	clinging	nature	of	ultra-thin	films	require	the	understanding	of	their	elastic	and	adhesive	
properties	in	a	wide	range	of	circumstances	 from	 fabrications	to	applications.	Simultaneously	measuring	
both	properties,	however,	is	extremely	difficult	as	the	film	thickness	diminishes	to	nanoscales.	In	this	talk,	I	
will	show	our	recent	work	that	addresses	such	difficulties	through	peeling	by	vertically	pulling	thin	films	off	
from	 the	substrates	(we	 thus	refer	 to	it	as	“pull-to-peel”).	Particularly,	we	perform	in-situ	pull-to-peel	of	
graphene	and	MoS2	 films	in	a	scanning	electron	microscope	and	achieve	simultaneous	determination	of	
their	Young’s	moduli	and	adhesions	 to	gold	substrates.	This	is	in	striking	contrast	 to	 other	conceptually	
similar	 tests	 available	 in	 the	 literature,	 including	 indentation	 tests	 (only	 measuring	 elasticity)	 and	
spontaneous	 blisters	 (only	 measuring	 adhesion).	 Furthermore,	 we	 show	 a	 weakly	 nonlinear	 Hooke’s	
relation	for	the	pull-to-peel	response	of	two-dimensional	materials,	which	may	be	harnessed	for	the	design	
of	nanoscale	force	sensors	or	exploited	in	other	thin-film	systems.},
DOI = {10.32604/icces.2023.09223}
}