TY  - EJOU
AU  - Chen, Mengshuai 
AU  - Ragui, Karim 
AU  - Chen, Lin 

TI  - Numerical	Analysis	of	Supercritical	CO<sub>2</sub> Flow	and	Heat	Transfer	Inside	 Porous	Structures	on	a	Microchip
T2  - The International Conference on Computational \& Experimental Engineering and Sciences

PY  - 2023
VL  - 26
IS  - 4
SN  - 1933-2815

AB  - With	the	development	of	supercritical	fluid	technology,	supercritical	CO<sub>2</sub> has	great	applications	in	carbon	
sequestration,	soil	remediation,	recovery	of	petroleum	gas,	material	extraction	in	industrial	processes,	and	
product	 pure	 drug	 nanoparticles/nanocrystals.	 In	 these	 applications,	 the	 flow	 and	 heat	 transfer,	 phase	
change	of	sCO<sub>2</sub> in	porous	media	are	involved.	Combined	with	the	previous	research	methods,	we	establish	a	
three-dimensional	 microchannel	 chip	 porous	 media	 model.	 Using	 the	 numerical	 simulation	 method,	 we	
study	 the	 flow	 and	 heat	 transfer	 characteristics	 of	 sCO<sub>2</sub> in	 the	 microchannel	 chip	 porous	 media	 under	
different	 working	 conditions.	 The	 temperature,	 pressure	 and	 density	 distribution	 are	 obtained	 under	
different	working	conditions.	We	also	investigate	 the	influence	of	inlet	conditions	such	as	mass	 flow	and	
inlet	 temperature	 on	 pressure	 drop	 between	 inlet	 and	 outlet	 of	 porous	 media	 model	 and	 heat	 transfer	
coefficient	between	CO<sub>2</sub> and	heating	wall	of	microchannel	chip.	The	results	show	that	the	increase	of	mass	
flow	rate	and	inlet	temperature	will	increase	the	pressure	drop,	while	the	increase	of	outlet	pressure	will	
decrease	 the	 pressure	 drop.	 The	increase	 of	mass	 flow	will	 enhance	 heat	 transfer,	while	when	 the	inlet	
temperature	 exceeds	 the	 critical	 temperature	 of	 CO<sub>2</sub>,	 the	increase	 of	inlet	 temperature	 will	inhibit	 heat	
transfer.	 The	 variation	 of	 heat	 transfer	 coefficient	 in	 different	 regions	 of	 the	 numerical	 model	 is	 also	
observed.
KW  - Supercritical	CO<sub>2</sub>;	porous	structures; fluid	flow; heat	transfer; numerical	analysis

DO  - 10.32604/icces.2023.09526
