TY  - EJOU
AU  - Jiang, Haocheng 
AU  - Zhu, Jue 

TI  - Test and Simulation Researches on G550 Cold-Formed Steel at High  Temperature and High Strain Rate
T2  - The International Conference on Computational \& Experimental Engineering and Sciences

PY  - 2023
VL  - 27
IS  - 1
SN  - 1933-2815

AB  - The tests of dynamic mechanical properties of materials at high temperature and high strain rate has always 
been a difficult issue [1]. In order to perform the dynamic mechanical properties of G550 cold-formed steel 
at high temperature and high strain rate, a set of Hopkinson Tension test device which can synchronize with 
high temperature control is developed for material test [2]. The stress-strain curves obtained from the tests
were used to explore the influence of temperature and strain rate on the rheological properties of material 
by combining micro-analysis. The results show that G550 cold-formed steel has obvious strain rate 
hardening effect and temperature softening effect, and the influence of temperature on its rheological 
properties is greater than that of strain rate. Therefore, a modified Johnson-Cook constitutive model for 
G550 cold-formed steel is proposed based on the variation of temperature softening coefficient [3]. In order 
to verify the correctness of the constitutive model, a numerical high-temperature dynamic tensile test model 
was established. The modified Johnson-Cook constitutive model was written into a UMAT subprogram in 
Fortran language and assigned to the high-temperature dynamic tensile sample. Then, output the stressstrain curves in the post-processing results. Through mutual verification of simulation results and 
experimental data, it is found that the constitutive model can well describe the dynamic mechanical behavior 
of G550 cold-formed steel at high temperatures and high strain rates, and can provide references for finite 
element simulation of G550 cold-formed steel in high temperature, explosion and impact related fields.
KW  - Constitutive model; micro-analysis; rheological propertie; high strain rate; high temperature

DO  - 10.32604/icces.2023.09586