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ABSTRACT

Computational Environment for the Multiscale, Multi-Physics Resin Transfer Molding Process

B. J. Henz1, D. R. Shires2

Team Member, Comp. Eng. Light-Weight Structures, U.S. Army Research Laboratory, APG, MD, USA
Team Leader, Comp. Eng. Light-Weight Structures, U.S. Army Research Laboratory, APG, MD, USA

TSP_ICCES_13.pdf

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