@Article{jpm.2026.075379,
AUTHOR = {Mingyan He, Jiayu Fu, Fangyu Guo, Dawei Jiang, Ting Yang, Miaojun Xu, Zijian Wu, Bin Li},
TITLE = {Study on the Thermo-Mechanical Properties of Boron Phenolic Resin Composites Enhanced by Silicone Resin Modification and Multiple Ceramic Fillers},
JOURNAL = {Journal of Polymer Materials},
VOLUME = {43},
YEAR = {2026},
NUMBER = {1},
PAGES = {--},
URL = {http://www.techscience.com/jpm/v43n1/66885},
ISSN = {0976-3449},
ABSTRACT = {Phenolic resins are widely used in thermal protection, yet achieving simultaneous improvement in thermal stability and mechanical strength remains challenging. In this work, a vinyl-modified silicone resin (VMTQ) was synthesized and incorporated into a boron phenolic resin (BPF) matrix. Three composite ceramic fillers, Al<sub>2</sub>O<sub>3</sub>–SiO<sub>2</sub>–ZrO<sub>2</sub> (ASZ), Al<sub>2</sub>O<sub>3</sub>–SiO<sub>2</sub>–TiO<sub>2</sub> (AST), and Al<sub>2</sub>O<sub>3</sub>–SiO<sub>2</sub>–MgO (ASM), were further introduced to construct a multi-oxide synergistic reinforcement system. Thermogravimetric analysis shows that the maximum decomposition rate decreases by 0.2–0.3%·min<sup>−1</sup>, while the ASM/V3/BPF-3 composite exhibits a 74.53% increase in char yield at 800°C and a 163.3°C increase in initial decomposition temperature, confirming its significantly enhanced thermal stability. SEM/EDS and XRD analyses reveal that ASZ, AST, and ASM promote the formation of stable ceramic phases, with ASM generating the densest MgO–Al<sub>2</sub>O<sub>3</sub>–SiO<sub>2</sub> composite oxide layer. Mechanical testing demonstrates that ASZ improves vertical impact strength by 23.9%, AST increases parallel impact strength by 14.1%, and ASM enhances bending strength by 34.5% (316.8 MPa). These results clearly indicate that the combination of VMTQ modification with multi-oxide ceramic fillers can effectively elevate both the thermal stability and mechanical performance of BPF-based composites, providing a practical pathway for designing high-performance resins for demanding thermal-environment applications.},
DOI = {10.32604/jpm.2026.075379}
}