Jinhua Cui^1,2, Yuanyuan Zhang³, Zhiping Cai^1,*, Anfeng Liu⁴, Yangyang Li⁵

CMC-Computers, Materials & Continua, Vol.55, No.1, pp. 17-35, 2018, DOI:10.3970/cmc.2018.055.017

Abstract While smart devices based on ARM processor bring us a lot of convenience, they also become an attractive target of cyber-attacks. The threat is exaggerated as commodity OSes usually have a large code base and suffer from various software vulnerabilities. Nowadays, adversaries prefer to steal sensitive data by leaking the content of display output by a security-sensitive application. A promising solution is to exploit the hardware visualization extensions provided by modern ARM processors to construct a secure display path between the applications and the display device. In this work, we present a scheme named SecDisplay More >

A. Sammaiah¹, K. V. Padmaja¹, K. I. Suresh^*,2, R. B. N. Prasad¹

Journal of Renewable Materials, Vol.4, No.2, pp. 113-122, 2016, DOI:10.7569/JRM.2015.634118

Abstract This article reports the effect of epoxidized jatropha oil (EJO) on the thermal, cure and viscoelastic properties of epoxy resins. Epoxidized jatropha oil with an oxirane value of 5.0 was prepared and epoxy formulations containing different concentrations of EJO were evaluated for cure, morphology, thermal and viscoelastic properties. The curing temperature of the formulations increased with increasing EJO content. The glass transition temperature of the cured films decreased from 56 °C for unmodified epoxy resin to 23 °C for the sample with 60 wt% EJO reactive diluent, suggesting good plasticizing action. The thermal decomposition was More >

R. J. Johnson^∗, R. Pitchumani^†

Frontiers in Heat and Mass Transfer, Vol.1, No.1, pp. 1-9, 2010, DOI:10.5098/hmt.v1.1.3007

Abstract Much research is currently being performed with carbon nanotube additives to neat resin systems to enhance properties such as thermal and electrical conductivity, strength, modulus and damping. Fabrication of parts based on carbon nanotube filled resin systems requires information on their cure kinetics and rheology, which has been relatively less studied so far. This work presents an extensive experimental study that systematically characterizes the cure kinetics and viscosity as a function of degree of cure and temperature of EPON 815C/EPICURE 3274 epoxy resin system laden with carbon nanotubes. Studies are conducted to determine the effects More >

N. D. Ngo, K. K. Tamma¹

CMES-Computer Modeling in Engineering & Sciences, Vol.1, No.3, pp. 57-72, 2000, DOI:10.3970/cmes.2000.001.359

Abstract In the process modeling via Resin Transfer Molding (RTM) for thick composite sections, multi-layer preforms with varying thermophysical characteristics across the different layers, or for geometrically complex mold geometries with varying thicknesses, the assumption of a thin shell-like geometry is no longer valid. The flow in the through thickness direction is no longer negligible and current practices of treating the continuously moving flow front as two-dimensional and the temperature and cure as three-dimensional are not representative of the underlying physics. In view of these considerations, in the present study, the focus is on the non-isothermal… More >