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  • Open Access

    ARTICLE

    Analysis and Improvement of an Efficient Controlled Quantum Secure Direct Communication and Authentication Protocol

    Jifeng Zhong1,*, Zhihao Liu2,3,*, Juan Xu4

    CMC-Computers, Materials & Continua, Vol.57, No.3, pp. 621-633, 2018, DOI:10.32604/cmc.2018.03706

    Abstract The controlled quantum secure direct communication (CQSDC) with authentication protocol based on four particle cluster states via quantum one-time pad and local unitary operations is cryptanalyzed. It is found that there are some serious security issues in this protocol. An eavesdropper (Eve) can eavesdrop on some information of the identity strings of the receiver and the controller without being detected by the selective-CNOT-operation (SCNO) attack. By the same attack, Eve can also steal some information of the secret message that the sender transmits. In addition, the receiver can take the same kind of attack to More >

  • Open Access

    ARTICLE

    Secure Video Streaming with Lightweight Cipher PRESENT in an SDN Testbed

    Pengcheng Liu1, †, Xiaojun Wang1, †, S. R. Chaudhry1, Khalid Javeed2, Yue Ma3, *, Martin Collier1

    CMC-Computers, Materials & Continua, Vol.57, No.3, pp. 353-363, 2018, DOI:10.32604/cmc.2018.04142

    Abstract The combination of traditional processors and Field Programmable Gate Arrays (FPGA) is shaping the future networking platform for intensive computation in resource-constrained networks and devices. These networks present two key challenges of security and resource limitations. Lightweight ciphers are suitable to provide data security in such constrained environments. Implementing the lightweight PRESENT encryption algorithm in a reconfigurable platform (FPGAs) can offer secure communication service and flexibility. This paper presents hardware acceleration of security primitives in SDN using NETFPGA-10G. We implement an efficient design of the PRESENT algorithm for faster, smaller and lower power consumption hardware More >

  • Open Access

    ARTICLE

    Design of ECC based Secured Cloud Storage Mechanism for Transaction Rich Applications

    V. Gopinath1, R. S. Bhuvaneswaran2

    CMC-Computers, Materials & Continua, Vol.57, No.2, pp. 341-352, 2018, DOI:10.32604/cmc.2018.04006

    Abstract Cloud computing is the highly demanded technology nowadays. Due to the service oriented architecture, seamless accessibility and other advantages of this advent technology, many transaction rich applications are making use of it. At the same time, it is vulnerable to hacks and threats. Hence securing this environment is of at most important and many research works are being reported focusing on it. This paper proposes a safe storage mechanism using Elliptic curve cryptography (ECC) for the Transaction Rich Applications (TRA). With ECC based security scheme, the security level of the protected system will be increased More >

  • Open Access

    ARTICLE

    Controlled Cyclic Remote State Preparation of Arbitrary Qubit States

    Mingming Wang1,2,*, Chen Yang1, Reza Mousoli3

    CMC-Computers, Materials & Continua, Vol.55, No.2, pp. 321-329, 2018, DOI:10.3970/cmc.2018.02064

    Abstract Quantum secure communications could securely transmit quantum information by using quantum resource. Recently, novel applications such as bidirectional and asymmetric quantum protocols have been developed. In this paper, we propose a new method for generating entanglement which is highly useful for multiparty quantum communications such as teleportation and Remote State Preparation (RSP). As one of its applications, we propose a new type of quantum secure communications, i.e. cyclic RSP protocols. Starting from a four-party controlled cyclic RSP protocol of one-qubit states, we show that this cyclic protocol can be generalized to a multiparty controlled cyclic More >

  • Open Access

    ARTICLE

    Securing Display Path for Security-Sensitive Applications on Mobile Devices

    Jinhua Cui1,2, Yuanyuan Zhang3, Zhiping Cai1,*, Anfeng Liu4, Yangyang Li5

    CMC-Computers, Materials & Continua, Vol.55, No.1, pp. 17-35, 2018, DOI:10.3970/cmc.2018.055.017

    Abstract While smart devices based on ARM processor bring us a lot of convenience, they also become an attractive target of cyber-attacks. The threat is exaggerated as commodity OSes usually have a large code base and suffer from various software vulnerabilities. Nowadays, adversaries prefer to steal sensitive data by leaking the content of display output by a security-sensitive application. A promising solution is to exploit the hardware visualization extensions provided by modern ARM processors to construct a secure display path between the applications and the display device. In this work, we present a scheme named SecDisplay More >

  • Open Access

    ARTICLE

    Effect of Epoxidized Jatropha Oil on the Cure, Thermal, Morphological and Viscoelastic Properties of Epoxy Resins

    A. Sammaiah1, K. V. Padmaja1, K. I. Suresh*,2, R. B. N. Prasad1

    Journal of Renewable Materials, Vol.4, No.2, pp. 113-122, 2016, DOI:10.7569/JRM.2015.634118

    Abstract This article reports the effect of epoxidized jatropha oil (EJO) on the thermal, cure and viscoelastic properties of epoxy resins. Epoxidized jatropha oil with an oxirane value of 5.0 was prepared and epoxy formulations containing different concentrations of EJO were evaluated for cure, morphology, thermal and viscoelastic properties. The curing temperature of the formulations increased with increasing EJO content. The glass transition temperature of the cured films decreased from 56 °C for unmodified epoxy resin to 23 °C for the sample with 60 wt% EJO reactive diluent, suggesting good plasticizing action. The thermal decomposition was More >

  • Open Access

    ARTICLE

    CHARACTERIZATION OF THE RHEOLOGY AND CURE KINETICS OF EPOXY RESIN WITH CARBON NANOTUBES

    R. J. Johnson, R. Pitchumani

    Frontiers in Heat and Mass Transfer, Vol.1, No.1, pp. 1-9, 2010, DOI:10.5098/hmt.v1.1.3007

    Abstract Much research is currently being performed with carbon nanotube additives to neat resin systems to enhance properties such as thermal and electrical conductivity, strength, modulus and damping. Fabrication of parts based on carbon nanotube filled resin systems requires information on their cure kinetics and rheology, which has been relatively less studied so far. This work presents an extensive experimental study that systematically characterizes the cure kinetics and viscosity as a function of degree of cure and temperature of EPON 815C/EPICURE 3274 epoxy resin system laden with carbon nanotubes. Studies are conducted to determine the effects More >

  • Open Access

    ARTICLE

    Non-Isothermal Three-Dimensional Developments and Process Modeling of Composites: Flow/Thermal/Cure Formulations and Experimental Validations

    N. D. Ngo, K. K. Tamma1

    CMES-Computer Modeling in Engineering & Sciences, Vol.1, No.3, pp. 57-72, 2000, DOI:10.3970/cmes.2000.001.359

    Abstract In the process modeling via Resin Transfer Molding (RTM) for thick composite sections, multi-layer preforms with varying thermophysical characteristics across the different layers, or for geometrically complex mold geometries with varying thicknesses, the assumption of a thin shell-like geometry is no longer valid. The flow in the through thickness direction is no longer negligible and current practices of treating the continuously moving flow front as two-dimensional and the temperature and cure as three-dimensional are not representative of the underlying physics. In view of these considerations, in the present study, the focus is on the non-isothermal… More >

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