Chyanbin Hwu¹, T.L. Kuo, Y.C. Chen

CMC-Computers, Materials & Continua, Vol.11, No.3, pp. 165-184, 2009, DOI:10.3970/cmc.2009.011.165

Abstract In this paper the near tip solutions for interface corners written in terms of the stress intensity factors are presented in a unified expression. This single expression is applicable for any kinds of interface corners including corners and cracks in homogeneous materials as well as interface corners and interface cracks lying between two dissimilar materials, in which the materials can be any kinds of linear elastic anisotropic materials or piezoelectric materials. Through this unified expression of near tip solutions, the singular orders of stresses and their associated stress/electric intensity factors for different kinds of interface problems can be determined through… More >

D. S. Liu¹, C. Y. Tsai¹, S. R. Lyu²

CMC-Computers, Materials & Continua, Vol.11, No.2, pp. 147-164, 2009, DOI:10.3970/cmc.2009.011.147

Abstract This study presents a novel numerical method for extracting the tempe -rature-dependent mechanical properties of the gold and aluminum thin-films. In the proposed approach, molecular dynamics (MD) simulations are performed to establish the load-displacement response of the thin substrate nanoindented at temperatures ranging from 300-900 K. A simple but effective procedure involving genetic algorithm (GA) and finite element method (FEM) is implemented to extract the material constants of the gold and aluminum substrates. The material constants are then used to construct the corresponding stress-strain curve, from which the elastic modulus, yield stress and the tangent modulus of the thin film… More >

Ching-Chi Hsu¹, Jinn Lin², Yongyut Amaritsakul³, Takalamesar Antonius³, Ching-Kong Chao^3,4

CMC-Computers, Materials & Continua, Vol.11, No.1, pp. 1-14, 2009, DOI:10.3970/cmc.2009.011.001

Abstract Dynamic hip screw and gamma nail have been widely used to treat the patients with proximal femoral fractures, but clinical failures of those implants are still to be found. This study developed three-dimensional finite element models to investigate the biomechanical performances of the implants. Two kinds of commercially available implants (dynamic hip screw and gamma nail) and one newly designed implant (double screw nail) under three kinds of the proximal femoral fractures (neck fracture, subtrochanteric fracture, and subtrochanteric fracture with gap) were evaluated. Double screw nail showed better biomechanical performances than dynamic hip screw and gamma nail. Two commercially available… More >

T. Nishioka¹, S. Tchouikov¹, T. Fujimoto¹

CMC-Computers, Materials & Continua, Vol.3, No.3, pp. 147-154, 2006, DOI:10.3970/cmc.2006.003.147

Abstract In this study, phenomena of multiple branching of dynamically propagating crack are investigated numerically. The complicated paths of cracks propagating in a material are simulated by moving finite element method based on Delaunay automatic triangulation (MFEM BODAT), which was extended for such problems. For evaluation of fracture parameters for propagating and branching cracks switching method of the path independent dynamic J integral was used. Using these techniques the generation phase simulation of multiple dynamic crack branching was performed. Various dynamic fracture parameters, which are almost impossible to obtain by experimental technique alone, were accurately evaluated. More >

Hamid Sharifi¹ and Augustin Gakwaya¹

CMC-Computers, Materials & Continua, Vol.3, No.2, pp. 77-96, 2006, DOI:10.3970/cmc.2006.003.077

Abstract In this paper, an object-oriented modeling of solid material constitutive behavior using the UML notation is presented. Material properties are first classified into large and small deformation kinematical models. In the small deformation package, we keep classes such as Elastic, ElastoPlastic, ViscoElastic and ViscoPlastic. In the large deformation package, we store classes such as ElastoPlastic, HyperElastic, HyperPlastic, HyperViscoElastic, HyperViscoPlastic and so on. The hierarchical structure, the association relationships as well as key attributes and methods of these classes are presented. We used a C++ implementation of the above model for developing HyperElastic, HyperElastoPlastic and Contact applications in the Diffpack environment. More >

Heng-Cheng Lin¹, Chieh Kung², Rong-Sheng Chen¹, Gin-Tiao Liang¹

CMC-Computers, Materials & Continua, Vol.3, No.2, pp. 55-64, 2006, DOI:10.3970/cmc.2006.003.055

Abstract Wafer level chip scale package (WLCSP) has been recognized providing clear advantages over traditional wire-bond package in relaxing the need of underfill while offering high density of I/O interconnects. Without the underfill, the solder joint reliability becomes more critical. Adding to the reliability concerns is the safety demand trend toward "green'' products on which unleaded material, e.g. lead-free solders, is required. The requirement of lead-free solders on the packages results in a higher reflow temperature profile in the package manufacturing process, in turn, complicating the reliability issue. This paper presents an optimization study, considering the fatigue reliability, for a wafer… More >

Lingfei Gao¹, Xiaoping Zheng^1,2, Zhenhan Yao¹

CMC-Computers, Materials & Continua, Vol.3, No.1, pp. 25-36, 2006, DOI:10.3970/cmc.2007.003.025

Abstract A general numerical approach is developed to model the elastic behaviours and failure processes of heterogeneous materials. The heterogeneous material body is assumed composed of a large number of convex polygon lattices with different phases. These phases are locally isotropic and elastic-brittle with the different lattices displaying variable material parameters and a Weibull-type statistical distribution. When the effective strain exceeds a local fracture criterion, the full lattice exhibits failure uniformly, and this is modelled by assuming a very small Young modulus value. An auto-select loading method is employed to model the failure process. The proposed hybrid approach is applied to… More >

I. Smojver¹, J. Sorić²

CMC-Computers, Materials & Continua, Vol.3, No.1, pp. 13-24, 2006, DOI:10.3970/cmc.2007.003.013

Abstract The paper addresses the problem of impact on layered fibre composites. The behaviour of composite laminates under impact loading is dependent not only on the velocity but also on the mass and geometry of the impactor. Using micromechanical Mori-Tanaka approach, mechanical properties of the laminate have been calculated utilizing the material constants of the fibre and matrix. General purpose FEM software ABAQUS has been modified by means of user written subroutines for modelling of composite laminate and rigid impactor. The kinematics of the impact has been simulated using transient dynamic analysis. Employing user defined multi point constraints, delamination zones have… More >

G. Mishuris¹, A. Öchsner², G. Kuhn³

CMC-Computers, Materials & Continua, Vol.2, No.4, pp. 227-238, 2005, DOI:10.3970/cmc.2005.002.227

Abstract FEM-evaluation of imperfect transmission conditions has been performed for a modelling problem of an elastic structure with a thin intermediate interface. Very good correlations with theoretical results have been obtained. Additionally, the possible error connected with introducing the transmission conditions instead of the intermediate zone has been estimated depending on mechanical properties of the zone. More >

A. Cazzani¹, E. Garusi², A. Tralli³, S.N. Atluri⁴

CMC-Computers, Materials & Continua, Vol.2, No.1, pp. 23-38, 2005, DOI:10.3970/cmc.2005.002.023

Abstract Fibre-reinforced plates and shells are finding an increasing interest in engineering applications. Consequently, efficient and robust computational tools are required for the analysis of such structural models. As a matter of fact, a large amount of laminate finite elements have been developed and incorporated in most commercial codes for structural analysis. \newline In this paper a new laminate hybrid assumed-strain plate element is derived within the framework of the First-order Shear Deformation Theory (i.e. assuming that particles of the plate originally lying along a straight line which is normal to the undeformed middle surface remain aligned along a straight line… More >