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  • Open Access

    ARTICLE

    Effects of High Magnetic Field on the Structure and Magnetic Properties of Molecular Beam Vapor Deposited Fe60Ni40 Thin Films

    Yongze Cao1, Guojian Li1, Qiang Wang1,2, Xiaoguang Wang3, Jiaojiao Du1, Jicheng He1

    CMC-Computers, Materials & Continua, Vol.37, No.3, pp. 195-203, 2013, DOI:10.3970/cmc.2013.037.195

    Abstract The Fe60Ni40 (in atomic %) polycrystalline thin films with 90 nm thickness were prepared on 200 °C quartz substrate by using molecular beam vapor deposition method. The influence of 0 T and 6 T magnetic fields on the structural evolution and magnetic properties of thin films was studied by using EDXS, XRD, AFM and VSM. In this study, only α phase was formed in both thin films. It was found that the application of a 6 T magnetic field obviously decreases the RMS of surface roughness and the grain size. For the magnetic properties of the thin films, the 6… More >

  • Open Access

    ARTICLE

    Effects of High Magnetic Field and Post-Annealing on the Evaporated Ni/Si (100) Thin Films

    Jiaojiao Du1, Guojian Li1, Qiang Wang1,2, Yongze Cao1, Jicheng He1, Yonghui Ma1

    CMC-Computers, Materials & Continua, Vol.34, No.2, pp. 117-129, 2013, DOI:10.3970/cmc.2013.034.117

    Abstract The effects of high magnetic field and post-annealing on the structural, electrical and magnetic properties of the evaporated Ni films were investigated and compared. The in-situ application of a 6 T magnetic field during evaporation or post-annealing at 200°C did not change the crystal structures of the films. However, the magnetic field makes the films exhibit the smallest grain size and the lowest surface roughness. Crystallinity was improved for both the 6 T films and the annealed films. This leads to the enhancement of saturation magnetization (Ms). The value of Ms for the 0 T films was 588 emu/cm3, while… More >

  • Open Access

    ARTICLE

    Indentation Load-Displacement Relations for the Spherical Indentation of Elastic Film/Substrate Structures

    S. N.V.R.K. Kurapati1, Y. C. Lu1, F. Yang2

    CMC-Computers, Materials & Continua, Vol.20, No.1, pp. 1-18, 2010, DOI:10.3970/cmc.2010.020.001

    Abstract The spherical indentation of elastic film /substrate structures is analyzed using the finite element method. The load-displacement curves of the film /substrate structures of various configurations are obtained and analyzed. A generalized power law relation is established, which can be used to analyze the load-displacement curve of elastic film /substrate systems under spherical indentations. The indentation load is dependent on the modulus ratio of the film to the substrate and film thickness. A semi-analytical expression for the power of the power law relation is also obtained as a function of the normalized film thickness and normalized film modulus, which can… More >

  • Open Access

    ARTICLE

    Theoretical Study on the Bilayer Buckling Technique for Thin Film Metrology

    Fei Jia1, Xiu-Peng Zheng1,2, Yan-Ping Cao1,3, Xi-Qiao Feng1

    CMC-Computers, Materials & Continua, Vol.18, No.2, pp. 105-120, 2010, DOI:10.3970/cmc.2010.018.105

    Abstract Recently, a novel technique based on the wrinkling of a bilayer composite film resting on a compliant substrate was proposed to measure the elastic moduli of thin films. In this paper, this technique is studied via theoretical analysis and finite element simulations. We find that under an applied compressive strain, the composite system may exhibit various buckling modes, depending upon the applied compressive strain, geometric and material parameters of the system. The physical mechanisms underlying the occurrence of the two most typical buckling modes are analyzed from the viewpoint of energy. When the intermediate layer is much thicker than the… More >

  • Open Access

    ARTICLE

    Young's Modulus Measurement of Thin Films by Resonant Frequency Method Using Magnetostrictive Resonator

    Hao-Miao Zhou1, Fang Li1, Qiang Ye1, Ji-Xiang Zhao1, Zhe-Lei Xia1, YingTang2, Jing Wei3

    CMC-Computers, Materials & Continua, Vol.13, No.3, pp. 235-248, 2009, DOI:10.3970/cmc.2009.013.235

    Abstract At present, there are many methods about Young's modulus measurement of thin films, but so far there is no recognized simple, non-destructive and cheaper standard measurement method. Considering thin films with various thicknesses were sputter deposited on the magnetostrictive resonator and monitoring the resonator's first-order longitudinal resonant frequency shift both before and after deposition induced by external magnetic field, an Young's modulus assessing method based on classical laminated plate theory is presented in this paper. Using the measured natural frequencies of Au, Cu, Cr, Al and SiC materials with various thicknesses in the literature, the Young's modulus of the five… More >

  • Open Access

    ARTICLE

    Determination of Temperature-Dependent Elasto-Plastic Properties of Thin-Film by MD Nanoindentation Simulations and an Inverse GA/FEM Computational Scheme

    D. S. Liu1, C. Y. Tsai1, S. R. Lyu2

    CMC-Computers, Materials & Continua, Vol.11, No.2, pp. 147-164, 2009, DOI:10.3970/cmc.2009.011.147

    Abstract This study presents a novel numerical method for extracting the tempe -rature-dependent mechanical properties of the gold and aluminum thin-films. In the proposed approach, molecular dynamics (MD) simulations are performed to establish the load-displacement response of the thin substrate nanoindented at temperatures ranging from 300-900 K. A simple but effective procedure involving genetic algorithm (GA) and finite element method (FEM) is implemented to extract the material constants of the gold and aluminum substrates. The material constants are then used to construct the corresponding stress-strain curve, from which the elastic modulus, yield stress and the tangent modulus of the thin film… More >

  • Open Access

    ARTICLE

    Simulation of Thin Film Delamination Under Thermal Loading

    L. Chernin1, K.Y. Volokh1,2

    CMC-Computers, Materials & Continua, Vol.1, No.3, pp. 259-274, 2004, DOI:10.3970/cmc.2004.001.259

    Abstract The conventional approach to analysis of thin film delamination is based on the consideration of the film, which is subjected to residual stresses arising from the thermal mismatch between the film and the substrate, within the framework of the classical fracture mechanics and the structural buckling theories. Such concepts as the energy release rate and the stress intensity factors are crucial in this case.

    A different approach to analysis of thin film delamination considers the effect of the compliant interface between the film and the substrate. This compliant interface is described by the traction-separation constitutive law.

    More >

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