Ying Wang^1,*, Yuqian Zheng¹

CMES-Computer Modeling in Engineering & Sciences, Vol.120, No.2, pp. 375-419, 2019, DOI:10.32604/cmes.2019.06905

Abstract A numerical simulation method for the damage evolution of high-strength steel wire in a bridge cable under the action of pre-corrosion and fatigue is presented in this paper. Based on pitting accelerated crack nucleation theory in combination with continuum mechanics, cellular automata technology (CA) and finite element (FE) analysis, the damage evolution process of steel wire under pre-corrosion and fatigue is simulated. This method automatically generates a high-strength steel wire model with initial random pitting defects, and on the basis of this model, the fatigue damage evolution process is simulated; thus, the fatigue life and fatigue performance of the corroded… More >

Jie Wang¹, Wei Jiang^1,*, Qi Wang¹

CMES-Computer Modeling in Engineering & Sciences, Vol.118, No.2, pp. 377-395, 2019, DOI:10.31614/cmes.2019.01836

Abstract A elastic-plastic fatigue crack growth (FCG) finite element model was developed for predicting crack growth rate under cyclic load. The propagation criterion for this model was established based on plastically dissipated energy. The crack growth simulation under cyclic computation was implemented through the ABAQUS scripting interface. The predictions of this model are in good agreement with the results of crack propagation experiment of compact tension specimen made of 304 stainless steel. Based on the proposed model, the single peak overload retardation effect of elastic-plastic fatigue crack was analyzed. The results shows that the single peak overload will reduce the accumulation… More >

Hai-Kun Wang^1,2, Robert Haynes³, Hong-Zhong Huang¹, Leiting Dong^2,4, Satya N. Atluri²

CMES-Computer Modeling in Engineering & Sciences, Vol.105, No.1, pp. 1-24, 2015, DOI:10.3970/cmes.2015.105.001

Abstract In this paper, we propose an approach for diagnostics and prognostics of damaged aircraft structures, by combing high-performance fatigue mechanics with filtering theories. Fast & accurate deterministic analyses of fatigue crack propagations are carried out, by using the Finite Element Alternating Method (FEAM) for computing SIFs, and by using the newly developed Moving Least Squares (MLS) law for computing fatigue crack growth rates. Such algorithms for simulating fatigue crack propagations are embedded in the computer program Safe- Flaw, which is called upon as a subroutine within the probabilistic framework of filter theories. Both the extended Kalman as well as particle… More >

Xiyong Huang¹, M. H. Aliabadi², Z. Sharif Khodaei³

CMES-Computer Modeling in Engineering & Sciences, Vol.102, No.4, pp. 291-330, 2014, DOI:10.3970/cmes.2014.102.291

Abstract In this paper, a stochastic dual boundary element formulation is presented for probabilistic analysis of fatigue crack growth. The method involves a direct differentiation approach for calculating boundary and fracture response derivatives with respect to random parameters. Total derivatives method is used to obtain the derivatives of fatigue parameters with respect to random parameters. First- Order Reliability Method (FORM) is applied to evaluate the most probable point (MPP). Opening mode fatigue crack growth problems are used as benchmarks to demonstrate the performance of the proposed method. More >

Leiting Dong^1,2, Satya N. Atluri^1,3

CMES-Computer Modeling in Engineering & Sciences, Vol.90, No.5, pp. 379-413, 2013, DOI:10.3970/cmes.2013.090.379

Abstract The SGBEM-FEM alternating method is compared with the recently popularized XFEM, for analyzing mixed-mode fracture and fatigue growth of 3D nonplanar cracks in complex solid and structural geometries. A large set of 3D examples with different degrees of complexity is analyzed by the SGBEM-FEM alternating method, and the numerical results are compared with those obtained by XFEM available in the open literature. It is clearly shown that: (a) SGBEM-FEM alternating method gives extremely high accuracy for the stress intensity factors; but the XFEM gives rather poor computational results, even for the most simple 3D cracks; (b) while SGBEM-FEM alternating method… More >

Leiting Dong^1,2, Satya N. Atluri^1,3

CMES-Computer Modeling in Engineering & Sciences, Vol.90, No.2, pp. 91-146, 2013, DOI:10.3970/cmes.2013.090.091

Abstract In this paper, and its companion Part 2 [Dong and Atluri (2013b)], the Symmetric Galerkin Boundary Element Method (SGBEM), and the SGBEM-FEM alternating/coupling methods, are compared with the recently popularized Extended Finite Element Method (XFEM), for analyzing fracture and fatigue crack propagation in complex structural geometries. The historical development, and the theoretical/algorithmic formulations, of each method are succinctly reviewed. The advantages and disadvantages of each method are critically discussed. A comprehensive evaluation of the performances of the SGBEM-based methods, and their comparison with XFEM, in modeling cracked solid structures undergoing fatigue crack-growth is carried out. A thorough examination of a… More >

A. Ramachandra Murthy¹, Nagesh R. Iyer¹, B.K. Raghu Prasad²

CMES-Computer Modeling in Engineering & Sciences, Vol.89, No.6, pp. 459-480, 2012, DOI:10.3970/cmes.2012.089.459

Abstract This paper presents the details of crack growth study and remaining life assessment of concrete specimens made up of high strength concrete (HSC, HSC1) and ultra high strength concrete (UHSC). Flexural fatigue tests have been conducted on HSC, HSC1 and UHSC beams under constant amplitude loading with a stress ratio of 0.2. It is observed from the studies that (i) the failure patterns of HSC1 and UHSC beams indicate their ductility as the member was intact till the crack propagated up to 90% of the beam depth and (ii) the remaining life decreases with increase of notch depth (iii) the… More >

Leiting Dong^1,2, Satya N. Atluri²

CMES-Computer Modeling in Engineering & Sciences, Vol.89, No.5, pp. 417-458, 2012, DOI:10.3970/cmes.2012.089.417

Abstract Two-dimensional weakly-singular Symmetric Galerkin Boundary Elements (SGBEMs) are developed, following the work of [Han and Atluri (2003)], using non-hypersingular integral equations for tractions. Specifically, the present 2D SGBEM is used to compute the stress intensity factors for arbitrary-shaped line cracks, including embedded, edge, branching, and intersecting cracks. The computed stress intensity factors show high accuracy, even with very coarse meshes. The non-collinear mixed-mode fatigue growth analysis of cracks requires a very minimal effort¡ªsimply extending the cracks by adding an element to each crack tip, in the direction of the crack-growth as determined by a physics-based criterion. Moreover, by rearranging the… More >

C. Du¹, H. Bai², J. Qu³, X. Su^1,4

CMES-Computer Modeling in Engineering & Sciences, Vol.61, No.3, pp. 223-248, 2010, DOI:10.3970/cmes.2010.061.223

Abstract Second, or higher, order harmonics have great potential in fatigue life prediction. In this study, the dispersion properties of waves propagating in the nonlinear random media are investigated. An one dimensional nonlinear model based on the nonlinear Hikata stress-strain relation is used. We applied perturbation method, the Liouville transformation and the smoothing approximation method to solve the one dimensional nonlinear stochastic wave equation. We show easily that the dispersion equations for all higher order terms will be the same with the corresponding linear random medium by perturbation method. The linear stochastic equation with two random coefficients is greatly simplified to… More >

Shaw-Jyh Shin¹, Chen-Hung Huang², Y.C. Shiah³

CMES-Computer Modeling in Engineering & Sciences, Vol.40, No.1, pp. 83-104, 2009, DOI:10.3970/cmes.2009.040.083

Abstract Owing to the CTE (Coefficient of Thermal Expansion) mismatch among solder joints, IC (Integrated Circuit) chip, and PCB (Printed Circuit Board), electronic packages shall experience fatigue failure after going though a period of thermal cycling. As a major means to enhance the reliability of the solder joints, underfill is often dispensed to fill the gap between the die and the substrate. This study aims at investigating how the underfill may affect the thermal fatigue life of WLCSP (Wafer Level Chip Scale Package) by means of FEA (finite element analysis). In this study, the thermal fatigue life of the WLCSP was… More >