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  • Open Access

    ARTICLE

    Effective Surface Susceptibility Models for Periodic Metafilms Within the Dipole Approximation Technique

    A.I. Dimitriadis1, N.V. Kantartzis1 and T.D. Tsiboukis1

    CMC-Computers, Materials & Continua, Vol.39, No.3, pp. 231-265, 2014, DOI:10.3970/cmc.2014.039.231

    Abstract The most important surface susceptibility models for the electromagnetic characterization of periodic metafilms, based on the dipole approximation method, are systematically analyzed in this paper. Specifically, two well-known techniques, which lead to a set of local effective surface parameters, are investigated along with a new dynamic non-local modeling algorithm. The latter formulation is properly expanded, in order to be applicable for any arbitrary periodic metafilm, irrespective of its way of excitation. The featured schemes are then directly compared toward their ability to efficiently predict the reflection and transmission properties of several lossless and lossy metafilms. More >

  • Open Access

    ARTICLE

    Rupture and Instability of Soft Films due to Moisture Vaporization in Microelectronic Devices

    Linsen Zhu1, Jiang Zhou2, Xuejun Fan2

    CMC-Computers, Materials & Continua, Vol.39, No.2, pp. 113-134, 2014, DOI:10.3970/cmc.2014.039.113

    Abstract In this paper, a damage mechanics-based continuum theory is developed for the coupled analysis of moisture vaporization, moisture absorption and desorption, heat conduction, and mechanical stress for a reflow process in microelectronic devices. The extremely compliant film has been used in wafer level lamination process. Such a soft film experiences cohesive rupture subjected to moisture absorption during reflow. The numerical simulation results have demonstrated that vapor pressure due to moisture vaporization is the dominant driving force for the failures. The correlation between the vapor pressure evolution and the film rupture observed from the experiments have… More >

  • Open Access

    RESIDENT’S CORNER

    The use of adhesion barrier film as an alternative to omental wrap in open ureterolysis

    Robert J. Hartman, Jr.1, Brian T. Helfand2, William W. Lin2

    Canadian Journal of Urology, Vol.20, No.6, pp. 7064-7066, 2013

    Abstract Retroperitoneal fibrosis (RPF) is a rarely occurring disease process characterized by the development of fibrous plaques that encase retroperitoneal organs and major vessels. The most common sequelae is obstructive uropathy secondary to ureteral compression. Ureterolysis with intraperitoneal transposition and omental wrapping has historically been a popularized means to relieve ureteral obstruction. We present the case of a 47-year-old man with bilateral hydronephrosis secondary to RPF. Due to insufficient length of omentum, we report the first documented use of SurgiWrap to wrap the ureters to minimize the future possibility of recurrent/continued fibrosis, compression, and ureteral obstruction. More >

  • Open Access

    ARTICLE

    INVESTIGATION OF PARTICULAR FEATURES OF THE NUMERICAL SOLUTION OF AN EVAPORATING THIN FILM IN A CHANNEL

    Greg Ball, John Polansky, Tarik Kaya*

    Frontiers in Heat and Mass Transfer, Vol.4, No.1, pp. 1-9, 2013, DOI:10.5098/hmt.v4.1.3002

    Abstract The fluid flow and heat transfer in an evaporating extended meniscus are numerically studied. Continuity, momentum, energy equations and the Kelvin-Clapeyron model are used to develop a third order, non-linear ordinary differential equation which governs the evaporating thin film. It is shown that the numerical results strongly depend on the choice of the accommodation coefficient and Hamaker constant as well as the initial perturbations. Therefore, in the absence of experimentally verified values, the numerical solutions should be considered as qualitative at best. It is found that the numerical results produce negative liquid pressures under certain More >

  • Open Access

    ARTICLE

    Comparison of EHD-Driven Instability of Thick and Thin Liquid Films by a Transverse Electric Field

    Payam Sharifi1, Asghar Esmaeeli2

    FDMP-Fluid Dynamics & Materials Processing, Vol.9, No.4, pp. 389-418, 2013, DOI:10.3970/fdmp.2013.009.389

    Abstract This study aims to explore the effect of liquid film thickness on the electrohydrodynamic-driven instability of the interface separating two horizontal immiscible liquid layers. The fluids are confined between two electrodes and the light and less conducting liquid is overlaid on the heavy and more conducting one. Direct Numerical Simulations (DNSs) are performed using a front tracking/finite difference scheme in conjunction with Taylor-Melcher leaky dielectric model. For the range of physical parameters used here, it is shown that for a moderately thick lower liquid layer, the interface instability leads to formation of several liquid columns… More >

  • Open Access

    ARTICLE

    Convective Film Condensation in an Inclined Channel with Porous Layer

    Lazhar Merouani1, Belkacem Zeghmati2, Azeddine Belhamri3

    FDMP-Fluid Dynamics & Materials Processing, Vol.9, No.3, pp. 267-290, 2013, DOI:10.3970/fdmp.2013.009.267

    Abstract The present work is a numerical study of laminar film condensation from vapor-gas mixtures in an inclined channel with an insulated upper wall and an isothermal lower wall coated with a thin porous material. A two-dimensional model is developed using a set of complete boundary layer equations for the liquid film and the steam-air mixture while the Darcy-Brinkman-Forchheimer approach is used for the porous material. The governing equations are discretized with an implicit finite difference scheme. The resulting systems of algebraic equations are numerically solved using Gauss and Thomas algorithms. The numerical results enable to More >

  • Open Access

    ARTICLE

    Process-dependent Thermal-Mechanical Behaviors of an Advanced Thin-Flip-Chip-on-Flex Interconnect Technology with Anisotropic Conductive Film Joints

    Hsien-Chie Cheng1,2, Chien-Hao Ma1, Ching-Feng Yu3, Su-Tsai Lu4, Wen-Hwa Chen2,3

    CMC-Computers, Materials & Continua, Vol.38, No.3, pp. 129-154, 2013, DOI:10.3970/cmc.2013.038.129

    Abstract User experiences for electronic devices with high portability and flexibility, good intuitive human interfaces and low cost have driven the development of semiconductor technology toward flexible electronics and display. In this study proposes, an advanced flexible interconnect technology is proposed for flexible electronics, in which an ultra-thin IC chip having a great number of micro-bumps is bonded onto a very thin flex substrate using an epoxy-based anisotropic conductive film (ACF) to form fine-pitch and reliable interconnects or joints (herein termed ACF-typed thin-flip-chip-on-flex (TFCOF) technology). The electrical and thermal -mechanical performances of the micro-joints are the… More >

  • Open Access

    ARTICLE

    Effects of High Magnetic Field on the Structure and Magnetic Properties of Molecular Beam Vapor Deposited Fe60Ni40 Thin Films

    Yongze Cao1, Guojian Li1, Qiang Wang1,2, Xiaoguang Wang3, Jiaojiao Du1, Jicheng He1

    CMC-Computers, Materials & Continua, Vol.37, No.3, pp. 195-203, 2013, DOI:10.3970/cmc.2013.037.195

    Abstract The Fe60Ni40 (in atomic %) polycrystalline thin films with 90 nm thickness were prepared on 200 °C quartz substrate by using molecular beam vapor deposition method. The influence of 0 T and 6 T magnetic fields on the structural evolution and magnetic properties of thin films was studied by using EDXS, XRD, AFM and VSM. In this study, only α phase was formed in both thin films. It was found that the application of a 6 T magnetic field obviously decreases the RMS of surface roughness and the grain size. For the magnetic properties of the More >

  • Open Access

    ARTICLE

    Effects of High Magnetic Field and Post-Annealing on the Evaporated Ni/Si (100) Thin Films

    Jiaojiao Du1, Guojian Li1, Qiang Wang1,2, Yongze Cao1, Jicheng He1, Yonghui Ma1

    CMC-Computers, Materials & Continua, Vol.34, No.2, pp. 117-129, 2013, DOI:10.3970/cmc.2013.034.117

    Abstract The effects of high magnetic field and post-annealing on the structural, electrical and magnetic properties of the evaporated Ni films were investigated and compared. The in-situ application of a 6 T magnetic field during evaporation or post-annealing at 200°C did not change the crystal structures of the films. However, the magnetic field makes the films exhibit the smallest grain size and the lowest surface roughness. Crystallinity was improved for both the 6 T films and the annealed films. This leads to the enhancement of saturation magnetization (Ms). The value of Ms for the 0 T More >

  • Open Access

    ARTICLE

    HEAT TRANSFER IN METAL FILMS IRRADIATED BY COMBINED NANOSECOND LASER PULSE AND FEMTOSECOND PULSE TRAIN

    Yunpeng Ren, J. K. Chen*, Yuwen Zhang

    Frontiers in Heat and Mass Transfer, Vol.3, No.2, pp. 1-7, 2012, DOI:10.5098/hmt.v3.2.3001

    Abstract Heat transfer in a copper film irradiated by a femtosecond (fs) laser pulse train and by an integrated dual laser beam of a nanosecond pulse with a fspulse train was studied using the semi-classical two-temperature model. The critical point model with three Lorentzian terms was employed to characterize transient optical properties for the laser energy deposition. The effects of pulse number and separation time on the thermal response were investigated. The results showed that with the same total energy in a fs-pulse train, more pulses for shorter separation time, e.g., 1 ps, and fewer pulses More >

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