Igor Patlashenko¹, Dan Givoli²

CMES-Computer Modeling in Engineering & Sciences, Vol.1, No.2, pp. 61-70, 2000, DOI:10.3970/cmes.2000.001.221

Abstract The method of Absorbing Boundary Conditions (ABCs) is considered for the numerical solution of a class of nonlinear exterior wave scattering problems. Recently, a scheme based on the exact nonlocal Dirichlet-to-Neumann (DtN) ABC has been proposed for such problems. Although this method is very accurate, it is also highly expensive computationally. In this paper, the nonlocal ABC is replaced by a low-order local ABC, which is obtained by localizing the DtN condition in a certain "optimal'' way. The performance of the new local scheme is compared to that of the nonlocal scheme via numerical experiments More >

K. Kaminishi¹, M. Iino², H. Bessho², M. Taneda³

CMES-Computer Modeling in Engineering & Sciences, Vol.1, No.1, pp. 107-110, 2000, DOI:10.3970/cmes.2000.001.107

Abstract An FEA (finite element analysis) program employing a new scheme for crack growth analysis is developed and a prediction method for crack growth life is proposed. The FEA program consists of the subroutines for the automatic element re-generation using the Delaunay Triangulation technique, the element configuration in the near-tip region being provided by a super-element, elasto-inelastic stress analyses, prediction of crack extension path and calculation of fatigue life. The FEA results show that crack extension rate and path are controlled by a maximum opening stress range, Δσ_θmax, at a small radial distance of r = d, where More >

N. Miyazaki¹, T. Tamura², K. Yamamoto¹

CMES-Computer Modeling in Engineering & Sciences, Vol.1, No.1, pp. 99-106, 2000, DOI:10.3970/cmes.2000.001.099

Abstract Quantitative estimation of the failure of a gadolinium orthosilicate (Gd₂SiO₅, hereafter abbreviated as GSO) single crystal induced by thermal stress was investigated. A GSO cylindrical test specimen was heated in a silicone oil bath, then subjected to large thermal stress by room temperature silicone oil. Cracking occurred during cooling. The transient heat conduction analysis was performed to obtain temperature distribution in the test specimen at the time of cracking, using the surface temperatures measured in the test. Then the thermal stress was calculated using the temperature profile of the test specimen obtained from the heat conduction… More >

K. Garikipati¹, V.S. Rao², M.Y. Hao³, E. Ibok⁴, I. de Wolf⁵, R. W. Dutton⁶

CMES-Computer Modeling in Engineering & Sciences, Vol.1, No.1, pp. 65-84, 2000, DOI:10.3970/cmes.2000.001.065

Abstract This work is based upon a careful rendering of mechanics and mathematics to describe the phenomena that influence the stress engendered by the Shallow Trench Isolation process. The diffusion-reaction problem is posed in terms of fundamental mass balance laws. Finite strain kinematics is invoked to model the large expansion of SiO₂, dielectrics are modelled as viscoelastic solids and annealing-induced density relaxation of SiO₂ is incorporated as a history-dependent process. A levelset framework is used to describe the moving Si/SiO₂ interface. Sophisticated finite element methods are employed to solve the mathematical equations posed for each phenomenon. These include More >

S. Taschini¹, J. Müller², A. Greiner², M. Emmenegger¹, H. Baltes¹, J.G. Korvink²

CMES-Computer Modeling in Engineering & Sciences, Vol.1, No.1, pp. 31-44, 2000, DOI:10.3970/cmes.2000.001.031

Abstract We present three techniques to accurately model the thermomechanical response of microsystem components: a new, accurate and stable Kirchhoff-Love multi-layered plate model implemented as an Argyris finite element, a model for the amplitude fluctuations of vibrational modes in micro-mechanical structures within a gaseous environment, and the consistent refinement of a finite element mesh in order to maximize the computational accuracy for a given mesh size. We have implemented these techniques in our in-house MEMS finite element program and accompanying Monte Carlo simulator. We demonstrate our approach to dynamic modeling by computing the thermomechanical response of More >

Philippe Matagne¹, Jean-Pierre Leburton², Jacques Destine, Guy Cantraine³

CMES-Computer Modeling in Engineering & Sciences, Vol.1, No.1, pp. 1-10, 2000, DOI:10.3970/cmes.2000.001.001

Abstract We investigate the quantum mechanical properties and single-electron charging effects in vertical semiconductor quantum dots by solving the Schrödinger and Poisson (SP) equations, self-consistently. We use the finite element method (FEM), specifically the Bubnov-Galerkin technique to discretize the SP equations. Owing to the cylindrical symmetry of the structure, the mesh is generated from hexahedral volume elements. The fine details of the electron spectrum and wavefunctions in the quantum dot are obtained as a function of macroscopic parameters such as the gate voltage, device geometry and doping level. The simulations provide comprehensive data for the analysis More >